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SBC-0870N

NXP Embedded Board

The SBC-0870N, powered by the NXP i.MX8M Plus, provides responsive edge processing and advanced multimedia capabilities for diverse industrial/commercial applications across various environments. Its form factor and efficient design make it suitable for a wide range of embedded solutions, supporting 8-inch displays with a multi-tasking OS and diverse connectivity.

Smarter Control Starts at the Edge

Combine reliable quad-core processing with the integrated 2.3 TOPS NPU to execute AI inference directly at the edge. This architecture enables consistent, low-latency responses for tasks like equipment monitoring, predictive maintenance, and basic object recognition without relying on the cloud.

Specifications

  • SoC: NXP i.MX 8M Plus
  • CPU: Quad-core Arm Cortex-A53
  • NPU: 2.3 TOPS

Visual Precision That Keeps Systems Moving

From live status dashboards to machine vision previews, the SBC-0870N delivers visual performance you can depend on. Hardware-accelerated processing ensures smooth playback and real-time responsiveness—without adding thermal or power overhead.

Specifications:

  • GPU: GC7000UL/GC520L (2D)
  • VDEC: 1080p60 HEVC/H.264/VP9/VP8
  • VENC: 1080p60 H.265/ H.264

Streamlined Deployment, Powered by Integrated I/O

Streamline hardware validation and reduce design cycles. Native interfaces for touch, audio, and sensors enable engineers to integrate peripherals directly, consolidating features onto a single platform for faster time-to-market.

Specifications:

  • GPIO for power/system button: 1 x 4pin (2GPIO)
  • I2C for ALS sensor: 1 x (FPC-10P-P0.5)
  • I2C for Touch panel: In MIPI Connector
  • LED Bar Connection: 2 x 4pin (SPI) (Left/Right)
  • Audio output for speaker: 2 x 2pin(L/R) ( 1.5W (max) with 8 ohms)
  • USB Port: 1 x Micro USB (ADB), 1 x USB Type A

Proven Android Expertise

Backed by over a decade of Qbic’s Android development expertise, the SBC-0870N delivers proven reliability and seamless integration on the latest Android version. Built for industrial environments, it ensures consistent performance, simplified deployment, and long-term lifecycle support for embedded edge systems.

TD-1070 - Android

Specifications

SOC PlatformNXP i.MX8M Plus
OS SupportAndroid 11 / Android 13
System
CPU ProcessorARM Quad-core Cortex- 4*A53
GPUGC7000UL/GC520L (2D)
APUNeural Processing Unit 2.3 TOPS
MemoryLPDDR4, 4GB
Storage32GB eMMC
VDEC1080p60, HEVC/H.264/VP9/VP8
VENC1080p60 H.265/H.264
Audio DSPHi-Fi 4
Ethernet10/100/1000M
WLAN ConnectivityNA
PoEPoE 802.3at
Display Connection
LVDSNA
eDPNA
MIPI1 x 41pin
Connection with Peripheral Function Modules
I2C for ALS sensor1 x (FPC-10P-P0.5)
I2C for Touch panelIn MIPI connector
Connection for LED Bar2 x 4pin (SPI) (Left/Right)
Audio output for Speaker2 x 2pin (L/R) (1.5W (max) with 8 ohms)
Microphone connectorNA
Video Input for CameraNA
NFC readerNA
GPIO for power/system button1 x 4pin (2GPIO)
I/O Interface
USB Port1 x USB Type C (ADB) ; 1 x USB Type A
Ethernet1 x RJ45 connector with PoE 802.3at
KNXNA
RS485NA
DC JackNA
Power Requirement1 x PoE 802.3at
Environment
Operating Temp.& Humidity0~45 degrees, 5% to 85%
Storage Temp.& Humidity-20~65 degrees, 5% to 90%
Mechanical
Dimension170mm (L) * 72.8mm (W) Top side <9mm ; Bottom side <2.7mm
Display support
Panel Size8 inches
Panel OrientationLandscape
Display Resolution1280 x 800
Brightness 350 cd/m2 (with touch)
Contrast Ratio1000:1
Touch5 points, multi-touch (PCAP)

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