SBC-1070M Hero Image

SBC-1070M

MTK Embedded Board

The SBC-1070M features the high-performance MediaTek Genio 510, engineered for demanding industrial and commercial applications across various sectors. It provides responsive edge processing and advanced multimedia capabilities, ideal for high-end embedded solutions. Powered by the latest Qbic Android OS, SBC-1070M also supports diverse connectivity options, and 8-inch, 10-inch, and 15-inch displays for all demanding applications.

Mission-Critical Power for the Edge

Built on the MediaTek Genio 510 platform, the SBC-1070M delivers exceptional computing headroom for concurrent, high-density data workloads. It ensures responsive edge analytics and dependable control for AI vision, robotics, and other mission-critical supervisory systems, making it a reliable choice for demanding industrial environments.

Specifications

  • SoC Platform: MediaTek Genio 510
  • CPU: ARM Hexa-core Cortex- 2*A78/4*A55
  • APU: 1x MDLA3.0 + 1x VP6

Seamless 4K Performance
You Can Rely On

The SBC-1070M delivers smooth, synchronized 4K @ 60 fps decode and encode across popular formats. Optimized for continuous visualization and process monitoring, it ensures frame-accurate playback and real-time clarity where every detail matters—whether in industrial automation, transportation, retail, or building management environments.

Specifications

  • GPU: MaliG57 MC2
  • VDEC: 4K60, AV1/VP9/H.265/H.264
  • VENC: 4K30, H.265/H.264

Dual-Band Connectivity for Uninterrupted Operations

With integrated WiFi 6 and Bluetooth 5.2, the SBC-1070M delivers high-bandwidth, low-latency connectivity for reliable remote configuration and secure back-channel communication. Its dual-band design enables flexible deployment and consistent performance across distributed, high-density, or dynamically changing environments.

Specifications

  • On-board WiFi 6, 802.11 a/b/g/n/ax/ax + BT 5.2
  • x2 I-PEX conn. for wifi antenna / x1 I-PEX conn. for BT antenna

Optimized I/O for Accelerated Deployment

In environments where every connection counts, flexibility drives reliability. The SBC-1070M’s comprehensive I/O suite enables seamless hardware integration without the complexity of add-on boards, simplifying validation and accelerating time-to-market for mission-critical deployments.

Specifications

  • Connections for ALS sensor, touch panel, LED bars, speakers, camera, and NFC reader
  • GPIO for power/system button: 4pin x1 (2GPIO)
  • USB Port: 1x USB Type C (OTG/ADB) ; 1x USB Type A (2.0)
  • Ethernet: 1x RJ45 connector with PoE 802.3at
  • KNX: KNX bus connection block (Red/Black), Certified KNX Stack (System B)
  • RS485: x1 (half duplex

Proven Android Expertise

Backed by over a decade of Qbic’s Android development expertise, the SBC-1070M delivers proven reliability and seamless integration on the latest Android version. Built for industrial environments, it ensures consistent performance, streamlined deployment, and long-term lifecycle support for embedded edge systems.

TD-1070 - Android

Specifications

SOC PlatformMediaTek Genio 510
OS SupportAndroid 13
System
CPU ProcessorARM Hexa-core Cortex- 2*A78/4*A55
GPUMaliG57 MC2
APU1x MDLA3.0 + 1x VP6
MemoryLPDDR4, 4GB
Storage32GB eMMC
VDEC4K60, AV1/VP9/H.265/H.264
VENC4K30, H.265/H.264
Audio DSPHi-Fi 5
Ethernet10/100/1000M
WLAN ConnectivityOn-board Wi-Fi 6, 802.11 a/b/g/n/ax/ax + BT 5.2
x2 I-PEX conn. for wifi antenna / x1 I-PEX conn. for BT antenna
PoEPoE 802.3at
Display Connection
LVDSNA
eDP40pin x1
MIPI41pin x1
Connection with Peripheral Function Modules
I2C for ALS sensor(FPC-10P-P0.5) X1
I2C for Touch panelin MIPI connector
Connection for LED Bar4pin (SPI) x2 (Left/Right)
Audio output for Speaker2pin(L/R) x2 ( 1.5W (max) with 8 ohms)
Microphone connector4pin X1 for DMIC
Video Input for Camera(24DS-0.8) x1, MIPI CSI-2,
NFC reader(I2C/ WB_8P_P0.6mm) x1 for external module
GPIO for power/system button4pin x1 (2GPIO)
I/O Interface
USB Port1x USB Type C (OTG/ADB) ; 1x USB Type A (2.0)
Ethernet1x RJ45 connector with PoE 802.3at
KNXKNX bus connection block (Red/Black), Certified KNX Stack (System B)
RS485x1 (half duplex)
DC Jack1x DC Jack
Power Requirement1x PoE 802.3af
1x DC-in, 12V/2A, (15" requires 12V/3A)
Environment
Operating Temp.& Humidity0~45 degrees, 5% to 85%
Storage Temp.& Humidity-20~65 degrees, 5% to 90%
Mechanical
Dimension170mm (L) *72.8mm (W) Top side <9mm ; Bottom side <2.7mm
Display support (8")
Panel Size8 inches
Panel OrientationLandscape
Display Resolution1280x 800
Brightness 300 cd/m2 (typ., with touch)
Contrast Ratio800:1
Display InterfaceMIPI with 41pins connection
Touch10 points, multi-touch (PCAP)
Display support (10")
Panel Size10.1 inches
Panel OrientationLandscape
Display Resolution1920x 1200
Brightness 350 cd/m2 (typ., with touch)
Contrast Ratio800:1
Display InterfaceMIPI with 41pins connection
Touch10 points, multi-touch (PCAP)
  
Display support (15") 
Panel Size15.6 inches
Panel OrientationLandscape
Display Resolution1920x 1080
Brightness 350 cd/m2 (typ., with touch)
Contrast Ratio800:1
Display InterfaceeDP with 40pins connection
Touch10 points, multi-touch (PCAP)

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